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== Comparison of Cortex-M Architectures ==
 
== Comparison of Cortex-M Architectures ==
 
*Most information here taken from https://en.wikipedia.org/wiki/ARM_Cortex-M*
 
  
 
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## M0
 
 
ARM Architecture Version ARMv6-M
 
- **Pipeline**: 3-Stage
 
- **Comp Arch**: von Neumann
 
- Optimised for physical silicon die size + cost
 
- Supports Thumb-1 and some of Thumb-2
 
 
## M0+
 
 
- **ARM Architecture Version**: ARMv6-M
 
- **Pipeline**: 2-Stage
 
- **Comp Arch**: von Neumann
 
- Superset of M0
 
- Optional MTB (micro trace buffer)
 
- Optional MPU (memory protection unit)
 
 
## M1
 
 
- **ARM Architecture Version**: ARMv6-M
 
- **Pipeline**: 3-Stage
 
- **Comp Arch**: von Neumann
 
- Optimized core especially designed to be loaded into FPGA chips.
 
 
## M3
 
 
- **ARM Architecture Version**: ARMv7-M
 
- **Pipeline**: 3-Stage + branch speculation
 
- **Comp Arch**: Harvard
 
- All Thumb instructions
 
- H/W divide
 
- Saturation arithmetic
 
- Optional MPU (memory protection unit)
 
 
## M4
 
 
- **ARM Architecture Version**: ARMv7E-M
 
- **Pipeline**: 3-Stage + branch speculation
 
- **Comp Arch**: Harvard
 
- Essentially M3 + DSP
 
- DSP: MAC + SIMD
 
- Optional FPU
 
- Optional MPU (memory protection unit)
 
 
## M7
 
 
- **ARM Architecture Version**: ARMv7E-M
 
- **Pipeline**: 6-Stage + branch speculation
 
- **Comp Arch**: Harvard
 
- High performance, ~2x efficiency of M4
 
- Superscaler
 
- 64-Bit Instruction + Data buses
 
  
 +
*Most information here taken from https://en.wikipedia.org/wiki/ARM_Cortex-M*
  
 
Vysvetlivky:
 
Vysvetlivky:

Aktuálna revízia z 10:30, 7. august 2023

Všeobecné informácie


Comparison of Cortex-M Architectures

M0 M0+ M1 M3 M4 M7
ARM Architecture ARMv6-M ARMv6-M ARMv6-M ARMv7-M ARMv7E-M ARMv7E-M
Pipeline 3-Stage 2-Stage 3-Stage 3-Stage
+ branch speculation
3-Stage
+ branch speculation
6-Stage
+ branch speculation
Architecture von Neumann von Neumann von Neumann Harvard Harvard Harvard
Functions: Optimised for
physical silicon
die size + cost
Superset of M0 Optimized core
designed to be loaded
into FPGA chips.
All Thumb
instructions
Essentially M3 + DSP High performance,
~2x efficiency of M4
Supports Thumb-1
and some of Thumb-2
Optional MTB
(micro trace buffer)
H/W divide DSP: MAC + SIMD Superscaler
Optional MPU
(memory protection unit)
Saturation arithmetic Optional FPU 64-Bit Instruction
+ Data buses
Optional MPU
(memory protection unit)
Optional MPU
(memory protection unit)


Vysvetlivky:

  • (m) - Matlab / Simulink Support Package Available
  • (M) - Matlab / Simulink Support Package Available and Tested
  • (-S) zatial neexistuje podpora pre Simulink
  • (mbed) - mbedOS available (v2 - version 2), (v5, v6) verzia
  • (+A,a) - Arduino programming possible, tested/not tested

mbedOS

Procesory Nordic Semiconductor


Procesory NXP

Rozličné FRDM dosky, doplň prehľad

  • FRDM KL-25Z (M),(mbed) - Cortex M0+


Procesory STM32

Marking:

STM	Manufacturer (STMicroelectronics) 	—-
32     32-bit MCU 	                        —- 
 F     Type of MCU 	                        F: Mainstream, L: Low power, H: High Performance, W: Wireless, C: Cost effective
 1	ARM Core Type 	                        0: M0, 1: M3, 2: M3, 3: M4, 4: M4, 7: M7
03     Line of MCU 	                        Details about speed, peripherals, Silicon Process, etc.
 C     No. of Pins 	                        F: 20, G: 28, K: 32, T: 36, S: 44, C: 48, R: 64,66, V: 100, Z: 144, I: 176
 8     Flash Size 	                        4: 16, 6: 32, 8: 64, B: 128, C: 256, D: 384, E: 512, F: 768, G: 1024, H: 1536, I: 2048 KB
 T     Package 	                        P: TSOOP, H: BGA, U: VFQFPN, T: LQFP, Y: WLCSP
 6     Temperature Range 	                6: -40°C to 85°C, 7: -40°C to 105°C

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